Advanced Technology Products
Current products Wintek manufacture include Backplanes, Hybrid boards, HDI boards, High TG boards, High Frequency boards, Halogen Free boards, Flex and Rigid Flex boards, Metal Substrate boards, IC Substrate boards and more type .

Min Line width/spacing(mil): 3.0/3.0
MaxAspect : 40:1
Board thickness(mil): 0.2mm~8.0mm
Max Panel size: 22.5¡å x 49¡å
Min CNC Drilling size : 4mil
Min Laser Drilling size : 3mil
MAX Fianl copper thickness : 12oz ( inner ) / 12oz ( outlayer )
Material: FR-4,High Tg FR-4,Halogen free,High Frequenc like Rogers Arlon Taconic and Nelco
Surface Treatment:
HASL,ENIG,ENEPIG,ImmersionSilver,ImmersionTin,FlashGold,GoldenFinger,OSP,Lead free HASL etc
Rigid-Flex Board
Mass production capacity for high density rigid-flex board fabrication
Layer Count/flex layer: 36/10
Min Line width/spacing for inner layer(mil) : 3.0/3.0
Max Aspect Ratio: 20:1
Min Hole size(mil): 6
Impedance control: 10%
HDI PCB
3+C+3: Mass production
4+C+4£ºSmall volume©}Mass production
5+N+5 : Samll volume & Sample
Laser via£¨Plugging via£©£ºMass production
Min microvia hole size(mil) £º4