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    Advanced Technology Products

     

    Current products Wintek manufacture include Backplanes, Hybrid boards, HDI boards, High TG boards, High Frequency boards, Halogen Free boards, Flex and Rigid Flex boards,  Metal Substrate boards, IC Substrate boards and more type .

                                   


    Production Capabilities                                          

     
    Layers count:  50

    Min Line width/spacing(mil):   3.0/3.0

    MaxAspect  :     40:1  
                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                                              
    Board thickness(mil):   0.2mm~8.0mm

    Max Panel size:    22.5 x 49

    Min CNC Drilling size : 4mil

    Min Laser Drilling size : 3mil

    MAX Fianl copper thickness : 12oz ( inner ) /  12oz ( outlayer )

    Material: FR-4,High Tg FR-4,Halogen free,High Frequenc like Rogers Arlon Taconic and Nelco
     
    Surface Treatment:
     
    HASL,ENIG,ENEPIG,ImmersionSilver,ImmersionTin,FlashGold,GoldenFinger,OSP,Lead free HASL etc
     

     Rigid-Flex Board

     
    Mass production capacity for high density rigid-flex board fabrication

    Layer Count/flex layer:    36/10

    Min Line width/spacing for inner layer(mil) :    3.0/3.0

    Max Aspect Ratio:   20:1
     
    Min Hole size(mil):   6

    Impedance control:  10%
     

    HDI PCB


    3+C+3: Mass production

    4+C+4Small volume}Mass production

    5+N+5 : Samll volume & Sample

    Laser viaPlugging viaMass production

    Min microvia hole size(mil) 4

     
     
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@2010 design by wanmey