Product list|Wintek Circuit / PCB Fabrication / Circuit Board / PCB Design / PCBA

Contact Us
910 China Nonfemet Building 6301 Futian District Shenzhen 518034
Phone:755-83223453
Fax:755-82570769
Email:sales@wintekcircuit.com; info@wintekcircuit.com, admin@wintekcircuit.com,
Monday to Friday24 hours support, Saturday 9:00am - 6pm EST

Products Show



                Back drilling Board                                                                                             Heavy copper PCB

Layer count ；12L   Thickness ：2.10mm                                                                                 Layer count ：14L Thickness ：3.0mm

Line /space : 5.0/5.0mil Smallest hole diameter ；0.50mm                                                      Surface finish : ENIG Line / Space : 20 / 20mil

Technology Feater ； 4 times high precision control depth drilling                                          Technology Feater : 10oz   Smallest hole : 0.80mm





          Rigid-Flex PCB                                                                                                                  HDI PCB

Layer counts : 4L ( 3F +1R ) Thickness : 1.35mm+/-0.14mm                                    Layer counts : 8L    Thickness ；4.25mm+/-0.25mm

Min hole size : 0.30mm Width / Space : 0.12mm/0.13mm                                        Min hole size : 0.70mm Width/ Space : 0.10mm / 0.127mm

Surface treatment : ENIG     Milary project                                                                 Asymmetrical Mechanical Two-Step Stair - Like HDI




    High-precision PCB                                                                                            Multi-layer Communication PCB

    Layers count : 22 L  Thickness : 1.78mm+/-0.18mm                                                        Layer count : 36L    Thickness 4.0+/-0.40mm

    Surface treament : Immersion Gold ;    Resin Plug hole technology                                   Min hole size : 0.508mm    Width / Space : 0.381mm / 0.18mm

    Technoogy Feater : 3 Steps HDI board                                                                 Innerlayer : 4oz Aspect Ratio : 16:1



    20L Rigid-Flex Board                                                                                      4 Layer Flex Board
Layer counts : 20L ;   Flex layer : 10L                                                                                   Layer counts : 4L Thickness : 1.56mm+/-0.156mm
Board thickenss : 3.0mm   Size : 465 x 173mm                                                                      Surface Treament : Immersion Gold
Surface Treament ； HASL                                                                                                      Applications : Power Electronics




Copper Paste Filling Board                                                                                    Gold Finger Board

Layer counts : 4L Thickness : 2.0 mm                                                                  Layer count : 16L Thickness :  3.80+/- 0.30mm

Width / Space : 0.25 / 0.18 mil                                                                             Line / Space :  0.50 / 0.50mil   Smallest hole : 0.350mm

Copper Paste Filling According to IPC-3                                                 Technology Feater : Hard Gold Plating / AU: 50u''  Broken Fingers



Al-Base Board                                                                                     Black Ink Rigid-Flex Board

Layer count : 1L   Thickness : 1.20+/- 0.12mm                                               Layer count : 4L (1R+2F+1R) Thicknes: 0.65±0.10 mm

Width / Space : 0.12mm / 0.08mm                                                                 Width/Space: 0.15 mm/0.12 mm      Min. Hole Size: 0.30 mm

Surface Treatment : OSP                                                                                 Surface Treatment: ENIG

LED Lighting                                                                                                  Consumer  Electronics